IEEE Std 3003.2 Grounding and Bonding – Tech Talk

Join us for our Tech Talk on IEEE 3003.2 Ground and Bonding. Find out more about: AC Substation Grounding Grid Design Basics Low Resistance Vs. High Resistance Vs. Solidly Grounded DC Equipment Enclosures Grounding Methods for Passenger Station Platform Screen Doors Co-sponsored by: IEEE Power and Energy Society Speaker(s): Raymond Strittmatter, Agenda: 4:00 pm PST IEEE Annnouncements 4:02 pm PST Introduction of speaker Raymond Strittmatter 4:04 pm PST Presentation 4:40 pm Q&A Virtual: https://events.vtools.ieee.org/m/289812