Artificial Intelligence (AI) has emerged as a revolutionary technology that is transforming various industries and aspects of our daily lives. The rapid arrival of real-time gaming, virtual reality, generative AI and metaverse applications are changing the way network, compute, memory, storage and interconnect I/O interact for the next decade. As AI continues to advance at an unprecedented pace, the network needs to adapt to the humongous growth in traffic connecting hundreds of processors with trillions of transactions and gigabits of throughput. As AI moves out of labs and research projects toward wide adoption, it will demand significant computing resources. We will try to cover the probable network architectures to support AI workloads and the technology required for it. Co-sponsored by: Seattle University Student Chapter Speaker(s): Urvish Panchal Agenda: Agenda: - 5.30 PM to 6.00 PM - Networking Event with the speaker and IEEE members. - 6.00 PM to 6.50 PM - Tech Talk and Question Hour. Room: Stuart T. Rolfe Community Room , Bldg: Admissions and Alumni building, Seattle University, 824 12th Ave, Seattle, WA 98122, Seattle, Washington, United States, 98122, Virtual: https://events.vtools.ieee.org/m/366272

IEEE Seattle Section Excom meeting with chapter and society chairs. Agenda: IEEE Seattle Section Excom meeting with chapter and society chairs. - Approval of past minutes. - Treasurer’s report - Secretary’s report - Chapter Reports - Affinity Group Reports - Student Branch Reports - Committee Chair Reports - On-going Business - Follow-up - New Business Items - Action Items; review and updates Room: Stuart T. Rolfe Community Room , Bldg: Admissions and Alumni building, Seattle University, 812 12th Ave, Seattle, Washington, United States, 98122, Virtual: https://events.vtools.ieee.org/m/366124

Systems are built by integrating components upwards from the lowest level of the supply chain to the finished, often highly complex, product. That upward integration process represents a potential security weakness. In that, without direct scrutiny or control from the OEM it is possible to surreptitiously insert malicious code, or counterfeit parts at the bottom of a multilevel, or offshored, build. And inevitably any malicious object inserted down the integration ladder will then be integrated into the end product, the most recent example being the SolarWinds hack of 2021. The possibility of such a thing occurring is so obvious that you would think that there have been practical efforts to address it. However, even though we’ve expended a lot of time and effort to ensure robust, efficient, and defect-free code production, we have done very little to ensure against compromises that might occur during the integration process. So, the aim of this talk is to outline the challenge of supply chain risk, as well as present a couple of potential solutions from the automobile industry. Speaker(s): Daniel Shoemaker, Virtual: https://events.vtools.ieee.org/m/364736

Systems are built by integrating components upwards from the lowest level of the supply chain to the finished, often highly complex, product. That upward integration process represents a potential security weakness. In that, without direct scrutiny or control from the OEM it is possible to surreptitiously insert malicious code, or counterfeit parts at the bottom of a multilevel, or offshored, build. And inevitably any malicious object inserted down the integration ladder will then be integrated into the end product, the most recent example being the SolarWinds hack of 2021. The possibility of such a thing occurring is so obvious that you would think that there have been practical efforts to address it. However, even though we’ve expended a lot of time and effort to ensure robust, efficient, and defect-free code production, we have done very little to ensure against compromises that might occur during the integration process. So, the aim of this talk is to outline the challenge of supply chain risk, as well as present a couple of potential solutions from the automobile industry. Speaker(s): Daniel Shoemaker, Virtual: https://events.vtools.ieee.org/m/364736

EXCOM Meeting Virtual: https://events.vtools.ieee.org/m/363177