Join us for the International Symposium on Computational Intelligence (ISCI) 2025, a premier virtual half-day event dedicated to advancing the field of Ethical AI. This symposium brings together leading researchers, practitioners, and thought leaders to explore cutting-edge developments in trustworthy, explainable, and responsible artificial intelligence. What to Expect - Expert Presentations - 30-45 minute talks from internationally recognized speakers - Interactive Q&A Sessions - 15-minute Q&A following each presentation - Global Perspective - Speakers from India, UK and beyond - Live Streaming - Real-time access via YouTube with archived sessions on IEEE.tv --------------------------------------------------------------- Talks & Speakers - Toward realizing user-level differential privacy at scale - Dr. Krishna Pillutla, IIT - Madras, India - Towards Logical Foundations for AI Ethics - Dr. Shrisha Rao & T.V. Priya, IIIT - Bangalore, India - Usable and Useful Artificial Intelligence: Explorations in Healthcare - Dr. Ann Blandford, University College London (UCL), UK - Empathic AI for Well-being Support: Challenges, Opportunities and Consequences - Dr. Alladin Ayesh, University of Aberdeen, UK - Human-AI Interfaces and Enhanced Communications with Intelligent Hearing Devices - Dr. Achintya Bhowmik, CTO - Starkey Hearing and Adjunct Professor - Stanford University, USA Co-sponsored by: Vishnu S. Pendyala, San Jose State University Speaker(s): Dr. Ann Blandford, Dr. Krishna Pillutla, Dr. Shrisha Rao, Dr. Aladdin Ayesh, Dr. Achin Bhowmik Agenda: Conference Schedule (PST) 8:00 AM - 8:05 AM Opening Remarks 8:05 AM - 9:05 AM Toward Realizing User-Level Differential Privacy at Scale Dr. Krishna Pillutla, IIT Madras, India 9:05 AM - 10:05 AM Towards Logical Foundations for AI Ethics Dr. Shrisha Rao & T.V. Priya, IIIT Bangalore, India 10:05 AM - 11:05 AM Usable and Useful Artificial Intelligence: Explorations in Healthcare Dr. Ann Blandford, University College London (UCL), UK 11:05 AM - 12:05 PM Empathic AI for Well-being Support: Challenges, Opportunities and Consequences Dr. Aladdin Ayesh, University of Aberdeen, UK 12:05 AM - 1:00 PM Human-AI Interfaces and Enhanced Communications with Intelligent Hearing Devices Dr. Achintya Bhowmik, CTO - Starkey Hearing and Adjunct Professor - Stanford University Virtual: https://events.vtools.ieee.org/m/495321
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Please join the IEEE Seattle section Life Member meeting EXCOM Meeting on September 9th 7pm - 8:30pm 2025 Agenda 6-7 pm IEEE Seattle section Life Member Kick off meeting 7-8:30pm IEEE Seattle Section EXCOM meeting Please use the following for Parking link https://www.offstreet.io/events/2ZI2CZWK and enter your vehicle license plate. Co-sponsored by: Joe Decuir Agenda: IEEE Seattle section EXCOM meeting 7PM meeting start - August EXCOM meeting minutes - Seattle section Financial 2024 Financial Resuts upgrade from " Partial Sateisfactory" to " Satisfactory" - Election - Chapters an branch report - Items - Adjourn Room: Bannan 629, Bldg: BANN, Seattle University 901 12th Avenue , Seattle, Washington, United States, 98122, Virtual: https://events.vtools.ieee.org/m/499848
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proposed agenda: - Present previous discussion and draft minutes: so they understand what happened - we plan to create intellectual property on industrial wisdom, targeted to Young Professionals and student members - Open issues: - Who generates it? E.g. members of the LMAG - Who reviews it? E.g. other members of LMAG, IEEE staff? - How to we publish it? E.g. videos, article(s), presentations by members of LMAG, IEEE TV? - Who has rights and responsibilities? - Present and discuss plans going forward: split into teams to illustrate/record/write up our industrial wisdom - Schedule next meeting(s) - Call for more volunteers to run LMAG; Joe is interim chair, Issac is interim secretary - We should conduct LMAG elections this year. Joe Decuir, IEEE Fellow UW Engineering Faculty M: 425-985-1562 E: jdecuir@ieee.org E: jdecuir@uw.edu Room: 629, Bldg: BANN, Seattle University 901 12th Avenue, Seattle, Washington, United States, 98122, Virtual: https://events.vtools.ieee.org/m/499856 |
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EXCOM Meeting for IEEE PES Seattle Officers Virtual: https://events.vtools.ieee.org/m/492307 |
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[] Abstract: The arrival of Wi-Fi 7 in early 2024, based on IEEE 802.11be, marks a paradigm shift in wireless networking—moving from single-link connections toward collaborative multi-link operation, enabling greater capacity and lower latency. With multi-link operation, Wi-Fi 7 can achieve a maximum throughput of 30 Gbps. While this peak throughput supports most existing applications, it falls short of meeting the strict reliability demands of emerging use cases such as the metaverse, augmented and virtual reality, robotics, and industrial automation. These challenges are driving the development of the next generation—Wi-Fi 8. To address these needs, the IEEE 802.11 Task Group bn has been established to define Ultra High Reliability (UHR) PHY and MAC layers. Their goal is to improve WLAN reliability, reduce latency, enhance manageability, and increase throughput across varying signal-to-noise ratios (SNRs). In this talk, we will identify and describe the key PHY and MAC elements that will shape Wi-Fi 8, which will operate in the 2.4 GHz, 5 GHz, and 6 GHz bands. We will also discuss the enabling mechanisms under design and present performance results where appropriate. Bio: Dr. Cheng Chen is a Senior Staff Wireless Standards Engineer at Intel Corporation. He leads Intel's standardization efforts on Wi-Fi sensing (802.11bf) and integrated millimeter wave (802.11bq) within the IEEE 802.11 Working Group, as well as Intel's Wi-Fi certification programs within the Wi-Fi Alliance. He currently serves as Editor for the IEEE 802.11bq Task Group, Technical Editor for the Wi-Fi 7 Technical Task Group, and Vice Chair of the Wi-Fi Sensing Task Group in the Wi-Fi Alliance. He previously served as Technical Editor for the Wi-Fi 6 Technical Task Group (July 2021–June 2022). Dr. Chen is a Senior Member of the IEEE and an IEEE ComSoc Distinguished Lecturer for the 2025–2026 term. He is an active contributor and voting member of multiple IEEE 802.11 standards, including 802.11ay (Next-generation 60 GHz Wi-Fi), 802.11be (Extremely High Throughput), 802.11bf (WLAN Sensing), 802.11bn (Ultra High Reliability), and 802.11bq (Integrated Millimeter Wave). He also contributes to several Wi-Fi Alliance certification programs, including Wi-Fi 6, Wi-Fi 6E, Wi-Fi 7, and Wi-Fi sensing. In recognition of his outstanding contributions across standards forums, Dr. Chen has received multiple awards, including the IEEE Standards Association Award for Outstanding Contributions to IEEE 802.11ay and the Wi-Fi Alliance Leadership Recognition Award for the Wi-Fi 6 launch. Dr. Chen earned his B.E. degree in Electronics and Information Engineering from Huazhong University of Science and Technology, Wuhan, China, in 2011, and his M.S. and Ph.D. degrees in Electrical Engineering from Northwestern University, Evanston, IL, in 2013 and 2016, respectively. Co-sponsored by: Pradeep Kumar Virtual: https://events.vtools.ieee.org/m/497970 |
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Summary: Built by the Army Corps of Engineers between 1933 and 1942, Grand Coulee Dam was the largest concrete structure in the world for decades. With the expansion of the third power station in 1974 made it the largest power plant in the world at the time. It still remains the largest power plant in the USA with a capacity of over 6 GW in three power stations. Tour Summary: The tour will start at 12:00 noon at the Visitor Center for a safety briefing. We will load into USBR vans and head to the Crown Point Viewing Area, North Dam, Banks Lake Headworks, Pumping Generating Plant, 3rd Powerhouse and top of the dam. Then back to the vans and visitor center by 4:30. Visit Requirements: · This is a hard hat, VIP tour of an operating power plant. Closed toe shoes and sensible clothing is required. Shorts, dresses, sleeveless shirts, tank tops, high heels are not permitted. · Photo ID is required for this tour. Unfortunately, US Citizens only due to the time it takes to perform background checks. US citizens will be asked to provide a copy of their ID sent directly by email or mail to the USBR at least one week in advance of the tour and will be required to present their driver’s licenses or valid ID the day of the tour. The email address of where to send your ID will be provided after registration. · No backpacks, fanny packs, bags, purses, etc., are allowed. Wallets fitting in a pocket are OK. Water will be provided along the way. · This is a technical tour for IEEE members and their quests. There is a shorter tour available for the public that may be more appropriate for others such as younger children. More info on the public tour can be found at https://www.usbr.gov/pn/grandcoulee/visit/index.html · Coming early or staying late, the daily nightly laser show starts at 8:30 pm. · There is a significant amount of standing, walking and climbing stairs on this tour. · Photos are allowed in most areas of the tour. Restricted areas will be pointed out. - Registration opens Friday July 25th. To attend this tour, you will need register by August 29th, 2025. - There is a $5.00 members and their family and $10 non-member registration fee to attend this tour. If a family member or guest is attending with you, they will need to be registered separately. Agenda: Agenda 12:00 pm – Check In, Welcome, Introductions and Safety Talk 12:30 pm – 4:30 Tour of the switchyard, Banks Lake Headwork, Coulee Dam and Powerhouses Highway 155, Grand Coulee, Washington, United States, 99116 |
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Describe how GPUs Accelerating genomics on AI/ ML. Speaker Bio Speaker Bio: Dr. Hari Sadasivan is a Sr AI Performance Engineer at NVIDIA, an affiliate assistant professor at the University of Washington, Seattle, and a Distinguished Visitor of the IEEE Computer Society. Hari’s research focuses on accelerating genomics and AI for drug discovery on GPUs. Previously, Hari led the AMD Center of Excellence in AI at UW Seattle and co-founded the AMD lifesciences group. Hari received his PhD and Masters in CSE from the University of Michigan Ann Arbor and worked at Samsung R&D before. Speaker(s): , Hari Sadasivan Agenda: Room: 629, Bldg: Bannan, 901 12th Ave, , Seattle , Washington, United States, 98122, Virtual: https://events.vtools.ieee.org/m/499863
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Describe how GPUs Accelerating genomics on AI/ ML. Speaker Bio Speaker Bio: Dr. Hari Sadasivan is a Sr AI Performance Engineer at NVIDIA, an affiliate assistant professor at the University of Washington, Seattle, and a Distinguished Visitor of the IEEE Computer Society. Hari’s research focuses on accelerating genomics and AI for drug discovery on GPUs. Previously, Hari led the AMD Center of Excellence in AI at UW Seattle and co-founded the AMD lifesciences group. Hari received his PhD and Masters in CSE from the University of Michigan Ann Arbor and worked at Samsung R&D before. This is a Hybrid Event Link is on the event site Speaker(s): , Hari Sadasivan Agenda: Room: 629, Bldg: Bannan, 901 12th Ave, , Seattle , Washington, United States, 98122, Virtual: https://events.vtools.ieee.org/m/499866 |
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Free Registration (with a Zoom account; you can get one for free if you don't already have it. This requirement is to avoid Zoom bombing. Please sign in using the email address tied to your Zoom account — not necessarily the one you used to register for the event.): https://sjsu.zoom.us/meeting/register/i6n2sgjLQFelwXCNz4-YGQ Synopsis: As large language models (LLMs) evolve from static, prompt-based tools into autonomous, agentic systems capable of reasoning, planning, and acting with minimal human oversight, organizations face an exciting yet complex frontier. These advanced systems hold the potential to revolutionize enterprise workflows, developer tools, and customer-facing applications—but realizing that potential requires navigating a host of technical and ethical challenges. This panel brings together leading voices from AI research, infrastructure engineering, and real-world application domains to discuss how agentic LLM systems are moving from lab experiments to production-grade deployments. Panelists will explore critical topics such as orchestration, safety, observability, and evaluation, while offering hard-earned lessons from deploying these systems at scale. Whether you're building tools for developers, integrating LLM agents into enterprise pipelines, or shaping the next wave of intelligent products, this discussion will equip you with the strategic and technical know-how to bring agentic AI into impactful, everyday use. Don’t miss this opportunity to learn what it truly takes to operationalize the future of AI. --------------------------------------------------------------- By registering for this event, you agree that IEEE and the organizers are not liable to you for any loss, damage, injury, or any incidental, indirect, special, consequential, or economic loss or damage (including loss of opportunity, exemplary or punitive damages). The event will be recorded and will be made available for public viewing. Speaker(s): Yubin Kim, Gautam Solaimalai, Shaleen Kumar Gupta, Vishal Jain, Abhay Khosla, Rahul Raja, Harsh Varshney Virtual: https://events.vtools.ieee.org/m/494702 |
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Join Dr. Ivan Tashev, Partner Software Architect at Microsoft Research, for an insightful session on "Generative Audio and Its Applications." Explore the cutting-edge role of audio in generative AI, from enhancing emotional connections to enabling multimodal experiences. Dr. Tashev will delve into innovative AI systems that generate and synchronize audio across different modalities, with real-world applications in fields like accessibility, entertainment, and beyond. This talk will feature key research from the Audio and Acoustics Research Group at Microsoft Research, shedding light on how generative audio is transforming the way we interact with technology. Topic: Generative audio and its applications Description: Audio—including sound and music—has the power to foster emotional connections and promote social bonding. As a vital human sense that complements vision, it remains relatively underexplored in generative AI research. By positioning audio as a key social-emotional layer of AI, we underscore its transformative potential in building more inspiring and context-aware systems. This talk presents an overview of key approaches within the broader generative AI landscape, with a focus on the role of audio. Audio-language models can generate captions, labels, or free-form text from audio signals, enabling applications such as question answering. Moreover, generating audio from prior audio inputs or from other modalities—such as text, images, or video—opens the door to compelling multimodal models and experiences. For instance, AI systems can synchronize audio and video streams or produce coordinated audio-visual outputs. The talk will be illustrated with research projects from the Audio and Acoustics Research Group at Microsoft Research. Biography: Dr. Ivan Tashev is a Partner Software Architect in Microsoft Research (MSR), Redmond, WA, USA, where he leads the Audio and Acoustics Research Group. His interests include multichannel signal processing and machine learning and artificial intelligence for signal processing. Ivan Tashev also coordinates the Brain-Computer Interfaces project in MSR. Dr. Tashev have published two books, two book chapters, 100+ scientific papers, listed as inventor in 50 US patents. Ivan Tashev is affiliate professor in the Department for Electrical and Computer Engineering of University of Washington in Seattle, USA, and honorary professor at Technical University of Sofia, Bulgaria. Technologies created by Dr. Tashev are incorporated in many Microsoft products, he served as the audio architect for Kinect and for HoloLens. He is an IEEE Fellow, member of AES and ASA. More details about him can be found in his web page https://www.microsoft.com/en-us/research/people/ivantash/. [] Agenda: 5 PM - 5.30 PM Networking and light snacks 5.30 PM - 6.30 PM Guest Talk by Distinguished Speaker Dr. Ivan Tashev 6.30 PM - 7.00 PM Networking and Wrap up Room: 629, Bldg: Bannan, 901 12th Ave, Seattle, Washington, United States, 98109-5210, Virtual: https://events.vtools.ieee.org/m/497967 |
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